- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Condiciones seleccionadas:
Descubre los productos 12
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | |
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NXP USA Inc. |
3,000
|
3 dias |
-
|
MOQ: 3000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2.55x2.55) | 18 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
|
|
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NXP USA Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2.55x2.55) | 18 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
|
|
|
NXP USA Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2.55x2.55) | 18 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
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NXP USA Inc. |
260
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 4K x 8 | 16KB (16K x 8) | 1K x 8 | ||
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|
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NXP USA Inc. |
480
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 48LQFP
|
Tray | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 42 | 4K x 8 | 16KB (16K x 8) | 1K x 8 | ||
|
|
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NXP USA Inc. |
457
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 28 | 6K x 8 | 24KB (24K x 8) | 2K x 8 | ||
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|
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NXP USA Inc. |
200
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
|
|
|
NXP USA Inc. |
213
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 42 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
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NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20WLCSP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | - | 18 | 4K x 8 | 16KB (16K x 8) | 2K x 8 | ||
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|
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 260 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 33HVQFN
|
Tray | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 2K x 8 | 8KB (8K x 8) | 512 x 8 | ||
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 28 | 6K x 8 | 24KB (24K x 8) | 2K x 8 | |||
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 28 | 8K x 8 | 32KB (32K x 8) | 4K x 8 |
