- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Speed：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Data Converters：
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- Condiciones seleccionadas:
Descubre los productos 52
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | |
|
|
|
NXP USA Inc. |
3,714
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 8K x 8 | 32KB (32K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
2,330
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC1100 | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 8K x 8 | 32KB (32K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
260
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 56KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 8K x 8 | 56KB (56K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
7,200
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 26 | 50MHz | 10K x 8 | 32KB (32K x 8) | 4K x 8 | A/D 8x10b | I2C，Microwire，SPI，SSI，SSP，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
4,000
|
3 dias |
-
|
MOQ: 4000 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 33HVQFN
|
Tape & Reel (TR) | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 2K x 8 | 8KB (8K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
4,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 33HVQFN
|
Cut Tape (CT) | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 2K x 8 | 8KB (8K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
4,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 33HVQFN
|
- | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 2K x 8 | 8KB (8K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
485
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC11Exx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 10K x 8 | 32KB (32K x 8) | 4K x 8 | A/D 8x10b | I2C，Microwire，SPI，SSI，SSP，UART/USART | ||
|
|
|
NXP USA Inc. |
913
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 26 | 50MHz | 6K x 8 | 32KB (32K x 8) | - | A/D 8x10b | I2C，Microwire，SmartCard，SPI，SSP，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
1,324
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 33HVQFN
|
Tray | LPC1100 | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 2K x 8 | 8KB (8K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
35,445
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100 | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 2K x 8 | 16KB (16K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
1,040
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 33HVQFN
|
Tray | LPC11Exx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 4K x 8 | 8KB (8K x 8) | 512 x 8 | A/D 8x10b | I2C，Microwire，SPI，SSI，SSP，UART/USART | ||
|
|
|
NXP USA Inc. |
721
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 26 | 50MHz | 6K x 8 | 32KB (32K x 8) | - | A/D 8x10b | I2C，Microwire，SmartCard，SPI，SSP，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
260
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 40KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 26 | 50MHz | 8K x 8 | 40KB (40K x 8) | 4K x 8 | A/D 8x10b | I2C，Microwire，SmartCard，SPI，SSP，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
323
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 26 | 50MHz | 10K x 8 | 64KB (64K x 8) | 4K x 8 | A/D 8x10b | I2C，Microwire，SmartCard，SPI，SSP，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
252
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 4K x 8 | 8KB (8K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
320
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 2K x 8 | 16KB (16K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
674
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 4K x 8 | 16KB (16K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
29
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 4K x 8 | 16KB (16K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
487
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 28 | 50MHz | 4K x 8 | 32KB (32K x 8) | - | A/D 8x10b | I2C，SPI，UART/USART |
