- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Number of I/O：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Data Converters：
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- Oscillator Type：
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Descubre los productos 235
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
5,000
|
3 dias |
-
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MOQ: 5000 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16TSSOP
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Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
7,413
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
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Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
7,413
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
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- | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
7,439
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
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Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
4,680
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | S08 | 39 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
4,000
|
3 dias |
-
|
MOQ: 2000 MPQ: 1
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IC MCU 8BIT 60KB FLASH 48QFN
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Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
5,938
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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IC MCU 8BIT 60KB FLASH 48QFN
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
5,938
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
- | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
19,692
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 44QFP
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Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | S08 | 36 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
2,468
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 32QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S08 | 24 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | A/D 4x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
2,002
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 32KB FLASH 44QFP
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Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | S08 | 36 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
462
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 60KB FLASH 64LQFP
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Tray | S08 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | S08 | 56 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
344
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 60KB FLASH 44QFP
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Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | S08 | 36 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
2,000
|
3 dias |
-
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MOQ: 1000 MPQ: 1
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IC MCU 16BIT 16KB FLASH 28SOIC
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Tape & Reel (TR) | 56F8xxx | -40°C ~ 105°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | 56800E | 23 | 32MHz | 1K x 16 | 16KB (8K x 16) | - | A/D 15x12b | Internal | I2C，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
2,000
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 16KB FLASH 28SOIC
|
Cut Tape (CT) | 56F8xxx | -40°C ~ 105°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | 56800E | 23 | 32MHz | 1K x 16 | 16KB (8K x 16) | - | A/D 15x12b | Internal | I2C，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
2,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 28SOIC
|
- | 56F8xxx | -40°C ~ 105°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | 56800E | 23 | 32MHz | 1K x 16 | 16KB (8K x 16) | - | A/D 15x12b | Internal | I2C，LINbus，SCI，SPI | 16-Bit | ||
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|
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NXP USA Inc. |
12,250
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 16-VQFN Exposed Pad | 16-QFN-EP (5x5) | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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|
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NXP USA Inc. |
1,898
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16DIP
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Tube | S08 | -40°C ~ 85°C (TA) | 16-DIP (0.300"，7.62mm) | 16-DIP | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
882
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 8SOIC
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Tube | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | S08 | 4 | 20MHz | 256 x 8 | 4KB (4K x 8) | - | A/D 4x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
3,768
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | S08 | 4 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | A/D 4x10b | Internal | I2C，SCI，SPI | 8-Bit |
