- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Peripherals:
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- RAM Size:
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- Program Memory Size:
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- EEPROM Size:
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- Data Converters:
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- Connectivity:
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- Condiciones seleccionadas:
Descubre los productos 28
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | ||
NXP USA Inc. |
296
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 4K x 8 | 64KB (64K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
894
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | 92 | 4K x 8 | 64KB (64K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
2,241
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 8K x 8 | 128KB (128K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
1,021
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | 91 | 16K x 8 | 256KB (256K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
354
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 4K x 8 | 64KB (64K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
7
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | 91 | 8K x 8 | 128KB (128K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
9
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 8K x 8 | 128KB (128K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
15
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | 91 | 16K x 8 | 256KB (256K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
S12E 16-BIT MCU HCS12 CORE 32K
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 4K x 8 | 32KB (32K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 4K x 8 | 32KB (32K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
S12E 16-BIT MCU HCS12 CORE 128
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 8K x 8 | 128KB (128K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
S12E 16-BIT MCU HCS12 CORE 64K
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 4K x 8 | 64KB (64K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | 91 | 8K x 8 | 128KB (128K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | 91 | 16K x 8 | 256KB (256K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LCD,Motor control PWM,POR,PWM,WDT | 91 | 6K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LCD,Motor control PWM,POR,PWM,WDT | 91 | 6K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 4K x 8 | 64KB (64K x 8) | - | A/D 16x10b,D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | 92 | 4K x 8 | 64KB (64K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 8K x 8 | 128KB (128K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | 60 | 8K x 8 | 128KB (128K x 8) | - | A/D 16x10b; D/A 2x8b | EBI/EMI,I2C,SCI,SPI |