- Series：
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- Operating Temperature：
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- Supplier Device Package：
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- Peripherals：
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- Core Processor：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Data Converters：
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- Oscillator Type：
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Descubre los productos 265
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
287
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3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 91 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
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NXP USA Inc. |
466
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 119 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
510
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
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NXP USA Inc. |
1,262
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR，PWM，WDT | HCS12 | 31 | 16MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
897
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR，PWM，WDT | HCS12 | 31 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | 16-Bit | ||
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|
|
NXP USA Inc. |
761
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 52-LQFP | 52-TQFP (10x10) | POR，PWM，WDT | HCS12 | 35 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | 16-Bit | ||
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|
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NXP USA Inc. |
1,332
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR，PWM，WDT | HCS12 | 31 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
844
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR，PWM，WDT | HCS12 | 31 | 16MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
480
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | POR，PWM，WDT | HCS12 | 60 | 16MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
479
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
420
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 64KB (64K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
798
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 52-LQFP | 52-TQFP (10x10) | POR，PWM，WDT | HCS12 | 35 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
284
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
405
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
692
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 91 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
370
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
103
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
519
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
111
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
220
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | 16-Bit |
