- Packaging：
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- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Peripherals：
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- Core Processor：
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- Speed：
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- RAM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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Descubre los productos 60
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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NXP USA Inc. |
380
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
380
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
425
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 450 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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TRIPLE CORE 6M FLASH
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 450 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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TRIPLE CORE 6M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 450 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 84 MPQ: 1
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IC MCU 32BIT 6MB FLASH 324MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 324-LBGA | 324-MAPBGA (19x19) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 246 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA，POR，PWM | e200z7 | - | 180MHz | 384K x 8 | 1.14 V ~ 1.32 V | A/D 64x12b | CANbus，EBI/EMI，SCI，SPI | 32-Bit Dual-Core |
