- Packaging：
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- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Peripherals：
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- Core Processor：
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- Program Memory Size：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Connectivity：
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- Core Size：
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- Condiciones seleccionadas:
Descubre los productos 95
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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NXP USA Inc. |
380
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4，e200z4 | 80MHz/160MHz | 768K x 8 | 6MB (6M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Tri-Core | ||
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NXP USA Inc. |
200
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3 dias |
-
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MOQ: 1 MPQ: 1
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DUAL CORE 3M FLASH 384K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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SINGLE CORE 2M FLASH 256K RAM
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 3
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 3
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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SINGLE CORE，1.5M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 160MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 1.5M FLASH
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z2，e200z4 | 80MHz，160MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 2M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z2，e200z4 | 80MHz，160MHz | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core |
