- Packaging：
-
- Operating Temperature：
-
- Speed：
-
- RAM Size：
-
- Program Memory Size：
-
- Voltage - Supply (Vcc/Vdd)：
-
- Data Converters：
-
- Condiciones seleccionadas:
Descubre los productos 53
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|
|
|
NXP USA Inc. |
296
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | EBI/EMI，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,241
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 8K x 8 | 128KB (128K x 8) | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | EBI/EMI，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
555
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 4K x 8 | 128KB (128K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
557
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 16MHz | 2K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,010
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 25MHz | 2K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,950
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
480
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 105°C (TA) | 16MHz | 2K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
479
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 2K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
420
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
354
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | EBI/EMI，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
220
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 2K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 4K x 8 | 128KB (128K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
9
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 25MHz | 8K x 8 | 128KB (128K x 8) | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | EBI/EMI，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 1K x 8 | 16KB (16K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 25MHz | 2K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
S12E 16-BIT MCU HCS12 CORE 32K
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 25MHz | 4K x 8 | 32KB (32K x 8) | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | EBI/EMI，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 25MHz | 4K x 8 | 32KB (32K x 8) | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | EBI/EMI，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 105°C (TA) | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus，EBI/EMI，SCI，SPI |
