- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- RAM Size:
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- Program Memory Size:
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- Data Converters:
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- Condiciones seleccionadas:
Descubre los productos 64
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | ||
NXP USA Inc. |
200
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 176LQFP
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 192K x 8 | 1.5MB (1.5M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
200
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 176LQFP
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 192K x 8 | 1.5MB (1.5M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
180
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 208LQFP
|
Tray | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | 177 | 256K x 8 | 3MB (3M x 8) | A/D 33x10b,10x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 256K x 8 | 3MB (3M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 176LQFP
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 256K x 8 | 2MB (2M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 256K x 8 | 3MB (3M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 176LQFP
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 256K x 8 | 3MB (3M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | 199 | 256K x 8 | 3MB (3M x 8) | A/D 33x10b,10x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 256K x 8 | 3MB (3M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 450 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | 199 | 256K x 8 | 3MB (3M x 8) | A/D 33x10b,10x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 176LQFP
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 256K x 8 | 3MB (3M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 180 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tray | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | 177 | 256K x 8 | 3MB (3M x 8) | A/D 33x10b,10x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 180 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tray | -40°C ~ 105°C (TA) | 208-LQFP | 208-TQFP (28x28) | 177 | 256K x 8 | 3MB (3M x 8) | A/D 33x10b,10x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 180 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP | 208-TQFP (28x28) | 177 | 256K x 8 | 3MB (3M x 8) | A/D 33x10b,10x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | 199 | 256K x 8 | 3MB (3M x 8) | A/D 33x10b,10x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 180 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | 177 | 256K x 8 | 3MB (3M x 8) | A/D 33x10b,10x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
1.5M FLASH128K RAM
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 192K x 8 | 1.5MB (1.5M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 256K x 8 | 2MB (2M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 192K x 8 | 1.5MB (1.5M x 8) | A/D 27x10b,5x12b | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | 147 | 192K x 8 | 1.5MB (1.5M x 8) | A/D 27x10b,5x12b |