- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Connectivity:
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- Core Size:
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- Condiciones seleccionadas:
Descubre los productos 208
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 760 MPQ: 1
|
C55G-PANTHER (CUT 2.2B)
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA,LVD,POR,WDT | - | 150MHz | 384K x 8 | 2.5MB (2.5M x 8) | - | 3.15 V ~ 5.5 V | A/D 64x12b | CANbus,Ethernet,FlexRay, LINbus,SPI,UART/USART | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 880 MPQ: 1
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SINGLE CORE,3M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
|
32-BIT MCU DUAL CORE POWER ARCH
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA,LVD,POR,WDT | - | 200MHz | 384K x 8 | 2.5MB (2.5M x 8) | - | 3.15 V ~ 5.5 V | A/D 64x12b | CANbus,Ethernet,FlexRay, LINbus,SPI,UART/USART | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA,POR,PWM,WDT | - | 64MHz | 128K x 8 | 1MB (1M x 8) | - | 3 V ~ 5.5 V | A/D 32x12b | CANbus,FlexRay,LINbus,SPI,UART/USART | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1500 MPQ: 1
|
SINGLE CORE,3M FLASH
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1500 MPQ: 1
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SINGLE CORE 1.5M FLASH 192K RA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 120MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 880 MPQ: 1
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SINGLE CORE 1.5M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 160MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 880 MPQ: 1
|
SINGLE CORE,3M FLASH
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Tray | MPC57xx | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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SINGLE CORE,1.5M FLASH
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Tray | MPC57xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,I2S,POR,WDT | 129 | 120MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1500 MPQ: 1
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SINGLE CORE 3M FLASH 384 RAM
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 160MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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SINGLE CORE 2M FLASH 256K RAM
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,I2S,POR,WDT | - | 120MHz | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1500 MPQ: 1
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32 BIT SINGLE CORE 2M FLASH 1
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 120MHz | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 880 MPQ: 1
|
SINGLE CORE 1.5M FLASH
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 160MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 450 MPQ: 1
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NXP 32-BIT MCU DUAL POWER ARCH
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA,POR,PWM,WDT | - | 64MHz | 128K x 8 | 1MB (1M x 8) | - | 3 V ~ 5.5 V | A/D 32x12b | CANbus,FlexRay,LINbus,SPI,UART/USART | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA,POR,PWM,WDT | - | 120MHz | 128K x 8 | 1MB (1M x 8) | - | 3 V ~ 5.5 V | A/D 32x12b | CANbus,FlexRay,LINbus,SPI,UART/USART | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
NXP 32-BIT MCU DUAL POWER ARCH
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA,POR,PWM,WDT | - | 120MHz | 128K x 8 | 1MB (1M x 8) | - | 3 V ~ 5.5 V | A/D 32x12b | CANbus,FlexRay,LINbus,SPI,UART/USART | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1500 MPQ: 1
|
32 BIT,SINGLE CORE,2M FL
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 160MHz | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
|
MOQ: 1500 MPQ: 1
|
SINGLE CORE 3M FLASH
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 160MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
|
MOQ: 200 MPQ: 1
|
SINGLE CORE,1.5M FLASH
|
Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,I2S,POR,WDT | 129 | 120MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1000 MPQ: 1
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NXP 32-BIT MCU DUAL POWER ARCH
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA,POR,PWM,WDT | - | 120MHz | 128K x 8 | 1MB (1M x 8) | - | 3 V ~ 5.5 V | A/D 32x12b | CANbus,FlexRay,LINbus,SPI,UART/USART | 32-Bit Dual-Core |