- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Program Memory Size：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Connectivity：
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- Core Size：
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- Condiciones seleccionadas:
Descubre los productos 208
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | 129 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | 129 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 84 | 80MHz | 128K x 8 | 2MB (2M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 3
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | 129 | 120MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU DUAL POWER ARCH
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Tape & Reel (TR) | Automotive，AEC-Q100 MPC57xx | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，LVD，POR，Zipwire | - | 200MHz | 128K x 8 | 2MB (2M x 8) | - | 3.5 V ~ 5.5 V | A/D 12b SAR，16b Sigma-Delta | CANbus，Ethernet，I2C，LINbus，SCI，SPI，UART/USART | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 84 | 150MHz | 128K x 8 | 2MB (2M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 84 | 120MHz | 128K x 8 | 2MB (2M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 84 | 150MHz | 128K x 8 | 2MB (2M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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SINGLE CORE，3M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | 129 | 160MHz | 384K x 8 | 3MB (3M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 4MB FLASH 252MAPBGA
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Tape & Reel (TR) | Automotive，AEC-Q100 MPC57xx | -40°C ~ 125°C (TA) | 252-LFBGA | 252-MAPBGA (17x17) | DMA，LVD，POR，Zipwire | - | 200MHz | 256K x 8 | 4MB (4M x 8) | - | 3.5 V ~ 5.5 V | A/D 12b SAR，16b Sigma-Delta | CANbus，Ethernet，I2C，LINbus，SCI，SPI，UART/USART | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA，POR，PWM，WDT | 151 | 120MHz | 128K x 8 | 2MB (2M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 84 | 120MHz | 192K x 8 | 3MB (3M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 4MB FLASH 208MAPBGA
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | DMA，POR，PWM，WDT | 120 | 80MHz | 192K x 8 | 4MB (4M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 84 | 120MHz | 192K x 8 | 3MB (3M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 60 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA，POR，PWM，WDT | 151 | 80MHz | 128K x 8 | 2MB (2M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA，POR，PWM，WDT | 151 | 120MHz | 192K x 8 | 3MB (3M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 4MB FLASH 176LQFP
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 84 | 150MHz | 192K x 8 | 4MB (4M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 60 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA，POR，PWM，WDT | 151 | 120MHz | 128K x 8 | 2MB (2M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 4MB FLASH 324TEBGA
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA，POR，PWM，WDT | 151 | 80MHz | 192K x 8 | 4MB (4M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 450 MPQ: 1
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IC MCU 32BIT 4MB FLASH 208MAPBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | DMA，POR，PWM，WDT | 120 | 150MHz | 192K x 8 | 4MB (4M x 8) | - | 1.14 V ~ 5.25 V | A/D 40x12b | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit |
