- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Speed：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Oscillator Type：
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- Condiciones seleccionadas:
Descubre los productos 496
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
Consulta
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MOQ: 500 MPQ: 1
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16-BIT MCU S12X CORE 384KB FLA
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 80MHz | 20K x 8 | 384KB (384K x 8) | 4K x 8 | 3.15 V ~ 5.5 V | A/D 16x12b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 300 MPQ: 1
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16-BIT MCU S12X CORE 384KB FLA
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Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 80MHz | 20K x 8 | 384KB (384K x 8) | 4K x 8 | 3.15 V ~ 5.5 V | A/D 16x12b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 60 MPQ: 1
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16-BIT MCU S12X CORE 768KB FLA
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Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 50MHz | 48K x 8 | 768KB (768K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 500 MPQ: 1
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16-BIT MCU S12X CORE 512KB FLA
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b，16x10b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 300 MPQ: 1
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16-BIT MCU S12X CORE 512KB FLA
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Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b，16x10b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 60 MPQ: 1
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16-BIT MCU S12X CORE 768KB FLA
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Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 50MHz | 48K x 8 | 768KB (768K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 500 MPQ: 1
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16-BIT MCU S12X CORE 512KB FLA
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b，16x10b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
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912XDP512J1 GENERAL
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Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b，16x10b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 300 MPQ: 1
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16-BIT MCU S12X CORE 384KB FLA
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Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 80MHz | 20K x 8 | 384KB (384K x 8) | 4K x 8 | 3.15 V ~ 5.5 V | A/D 16x12b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 300 MPQ: 1
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16-BIT MCU S12X CORE 512KB FLA
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Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b，16x10b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 60 MPQ: 1
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16-BIT MCU S12X CORE 1MB FLASH
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Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 50MHz | 64K x 8 | 1MB (1M x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 300 MPQ: 1
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16-BIT MCU S12X CORE 512KB FLA
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Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b，16x10b | External | CANbus，EBI/EMI，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 84 MPQ: 1
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3 CAN 512 FLASH 32K RAM
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Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b，16x10b | External | CANbus，I2C，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 84 MPQ: 1
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IC MCU 16BIT 128KB FLASH 80QFP
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Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 80MHz | 8K x 8 | 128KB (128K x 8) | 2K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 500 MPQ: 1
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IC MCU 16BIT 128KB FLASH 112LQFP
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Tape & Reel (TR) | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 50MHz | 12K x 8 | 128KB (128K x 8) | 2K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | |||
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NXP USA Inc. |
Consulta
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-
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MOQ: 450 MPQ: 1
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16-BIT MCU S12X CORE 1MB FLASH
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Tray | -40°C ~ 85°C (TA) | 208-BGA | 208-MAPBGA (17x17) | LVD，POR，PWM，WDT | 152 | 50MHz | 64K x 8 | 1MB (1M x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 32x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI |
