- Series：
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- Operating Temperature：
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- Package / Case：
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- Peripherals：
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- Core Processor：
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- Number of I/O：
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- Speed：
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- RAM Size：
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- Program Memory Size：
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- Program Memory Type：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Oscillator Type：
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- Connectivity：
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- Condiciones seleccionadas:
Descubre los productos 336
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
2,950
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
2,156
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3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | PWM，WDT | HCS12 | 59 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | 1K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus，I2C，SCI，SPI | 16-Bit | ||
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|
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NXP USA Inc. |
361
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 80-QFP | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 32K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
1,207
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | PWM，WDT | HCS12 | 59 | 25MHz | 4K x 8 | 128KB (128K x 8) | Flash | 2K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
751
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | PWM，WDT | HCS12 | 59 | 25MHz | 8K x 8 | 128KB (128K x 8) | Flash | 2K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
413
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
718
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
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Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus，I2C，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
499
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
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Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | 16-Bit | ||
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|
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NXP USA Inc. |
285
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 80-QFP | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
480
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 80-QFP | POR，PWM，WDT | HCS12 | 60 | 16MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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|
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NXP USA Inc. |
479
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | POR，PWM，WDT | HCS12 | 60 | 25MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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|
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NXP USA Inc. |
420
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
354
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 80-QFP | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | - | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | Internal | EBI/EMI，I2C，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
225
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | PWM，WDT | HCS12 | 59 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | 1K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
289
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 80-QFP | PWM，WDT | HCS12 | 59 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | 1K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | 16-Bit | ||
|
|
|
Renesas Electronics America |
168
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | H8 H8S/2100 | -20°C ~ 75°C (TA) | 80-BQFP | POR，PWM，WDT | H8S/2000 | 58 | 10MHz | 4K x 8 | 128KB (128K x 8) | Flash | - | 2.7 V ~ 3.6 V | A/D 8x10b; D/A 2x8b | Internal | IrDA，SCI | 16-Bit | ||
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|
|
NXP USA Inc. |
284
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
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NXP USA Inc. |
405
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 14K x 8 | 256KB (256K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
103
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 80-QFP | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 32K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
519
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 80-QFP | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit |
