- Packaging：
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- Operating Temperature：
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- Package / Case：
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- RAM Size：
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- Program Memory Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Condiciones seleccionadas:
Descubre los productos 14
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | |
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Microchip Technology |
Consulta
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-
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MOQ: 3300 MPQ: 1
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IC MCU 8BIT 3.5KB FLASH 8UDFN
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Tape & Reel (TR) | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 1.8 V ~ 3.6 V | A/D 5x10b，D/A 1x5b | ||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 960 MPQ: 1
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IC MCU 8BIT 3.5KB FLASH 8UDFN
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Tube | PIC XLP 16F | -40°C ~ 125°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 1.8 V ~ 3.6 V | A/D 5x10b，D/A 1x5b | ||
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Microchip Technology |
2,408
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 2.3 V ~ 5.5 V | A/D 5x10b，D/A 1x5b | |||
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Microchip Technology |
1,051
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3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC XLP 16F | -40°C ~ 125°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 2.3 V ~ 5.5 V | A/D 5x10b，D/A 1x5b | |||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 128 x 8 | 3.5KB (2K x 14) | 1.8 V ~ 3.6 V | A/D 4x10b，D/A 1x5b | |||
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Microchip Technology |
2,070
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Cut Tape (CT) | PIC 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 128 x 8 | 3.5KB (2K x 14) | 1.8 V ~ 3.6 V | A/D 4x10b，D/A 1x5b | |||
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Microchip Technology |
2,070
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
- | PIC 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 128 x 8 | 3.5KB (2K x 14) | 1.8 V ~ 3.6 V | A/D 4x10b，D/A 1x5b | |||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 3300 MPQ: 1
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IC MCU 8BIT 7KB FLASH 8UDFN
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Tape & Reel (TR) | PIC XLP 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 5 | 256 x 8 | 7KB (4K x 14) | 1.8 V ~ 3.6 V | A/D 4x10b，D/A 1x5b | |||
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Microchip Technology |
2,057
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 7KB FLASH 8UDFN
|
Cut Tape (CT) | PIC XLP 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 5 | 256 x 8 | 7KB (4K x 14) | 1.8 V ~ 3.6 V | A/D 4x10b，D/A 1x5b | |||
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Microchip Technology |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 7KB FLASH 8UDFN
|
- | PIC XLP 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 5 | 256 x 8 | 7KB (4K x 14) | 1.8 V ~ 3.6 V | A/D 4x10b，D/A 1x5b | |||
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Microchip Technology |
860
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3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 1.8 V ~ 3.6 V | A/D 5x10b，D/A 1x5b | |||
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Microchip Technology |
Consulta
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 2.3 V ~ 5.5 V | A/D 5x10b，D/A 1x5b | |||
|
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Microchip Technology |
Consulta
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC XLP 12F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 128 x 8 | 3.5KB (2K x 14) | 1.8 V ~ 5.5 V | A/D 4x10b，D/A 1x5b | |||
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Microchip Technology |
Consulta
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 7KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC XLP 12F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 5 | 256 x 8 | 7KB (4K x 14) | 2.3 V ~ 5.5 V | A/D 4x10b，D/A 1x5b |
