- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Number of I/O：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Connectivity：
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- Core Size：
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- Condiciones seleccionadas:
Descubre los productos 474
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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NXP USA Inc. |
5,000
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3 dias |
-
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MOQ: 5000 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16TSSOP
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Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
7,413
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
7,413
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
- | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SCI，SPI | 8-Bit | ||
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|
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NXP USA Inc. |
7,439
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SCI，SPI | 8-Bit | ||
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Renesas Electronics America |
1,809
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 56KB FLASH 64LQFP
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Tray | H8 H8/300H Tiny | -20°C ~ 75°C (TA) | 64-LQFP | 64-LQFP (10x10) | H8/300H | 45 | 4K x 8 | 56KB (56K x 8) | - | 3 V ~ 5.5 V | A/D 8x10b | I2C，SCI | 16-Bit | ||
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NXP USA Inc. |
12,250
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 16-VQFN Exposed Pad | 16-QFN-EP (5x5) | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,898
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16DIP
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Tube | S08 | -40°C ~ 85°C (TA) | 16-DIP (0.300"，7.62mm) | 16-DIP | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
2,049
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 4KB FLASH 16TSSOP
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Tube | S08 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 14 | 512 x 8 | 4KB (4K x 8) | 128 x 8 | 2.7 V ~ 5.5 V | A/D 8x12b | LINbus，SPI，UART/USART | 8-Bit | ||
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NXP USA Inc. |
12,198
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 2KB FLASH 8SOIC
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Tube | RS08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | RS08 | 6 | 126 x 8 | 2KB (2K x 8) | - | 1.8 V ~ 5.5 V | A/D 4x10b | I2C，SPI | 8-Bit | ||
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NXP USA Inc. |
1,010
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tube | RS08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | RS08 | 14 | 254 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 5.5 V | A/D 12x10b | I2C | 8-Bit | ||
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NXP USA Inc. |
3,397
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 20SOIC
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Tube | RS08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | RS08 | 18 | 254 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 5.5 V | A/D 12x10b | I2C | 8-Bit | ||
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NXP USA Inc. |
882
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 4KB FLASH 8SOIC
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Tube | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | S08 | 4 | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 4x10b | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
3,768
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 8SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | S08 | 4 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 4x10b | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
2,678
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 4KB FLASH 8DIP
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Tube | S08 | -40°C ~ 85°C (TA) | 8-DIP (0.300"，7.62mm) | 8-PDIP | S08 | 4 | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 4x10b | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,561
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 32LQFP
|
Tray | S08 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 28 | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | I2C，LINbus，SPI，UART/USART | 8-Bit | ||
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|
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NXP USA Inc. |
226
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 44LQFP
|
Tray | S08 | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | S08 | 37 | 4K x 8 | 60KB (60K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | I2C，LINbus，SPI，UART/USART | 8-Bit | ||
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|
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NXP USA Inc. |
496
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | S08 | 57 | 4K x 8 | 60KB (60K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | I2C，LINbus，SPI，UART/USART | 8-Bit | ||
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NXP USA Inc. |
4,907
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 16TSSOP
|
Tube | RS08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | RS08 | 14 | 126 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 5.5 V | A/D 12x10b | I2C | 8-Bit | ||
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|
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NXP USA Inc. |
135
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44LQFP
|
Tray | S08 | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | S08 | 37 | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | I2C，LINbus，SPI，UART/USART | 8-Bit | ||
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|
|
NXP USA Inc. |
3,497
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 8SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | S08 | 4 | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 4x10b | - | 8-Bit |
