- Series:
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- Operating Temperature:
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- Core Processor:
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- Number of I/O:
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- Speed:
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- RAM Size:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Oscillator Type:
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- Connectivity:
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- Core Size:
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Descubre los productos 336
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
4,677
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | ARM Cortex-M0+ | 57 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | CANbus,I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
2,485
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 64LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 12V1 | 54 | 25MHz | 8K x 8 | 128KB (128K x 8) | 4K x 8 | 3.13 V ~ 5.5 V | A/D 12x10b | Internal | CANbus,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
2,186
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 54 | 40MHz | 2K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
2,916
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 54 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
462
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 56 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
Renesas Electronics America |
1,809
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 56KB FLASH 64LQFP
|
Tray | H8 H8/300H Tiny | -20°C ~ 75°C (TA) | H8/300H | 45 | 20MHz | 4K x 8 | 56KB (56K x 8) | - | 3 V ~ 5.5 V | A/D 8x10b | Internal | I2C,SCI | 16-Bit | ||||
NXP USA Inc. |
1,151
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 85°C (TA) | ARM Cortex-M0+ | 58 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | CANbus,I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
2,659
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | ARM Cortex-M0+ | 58 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | CANbus,I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
770
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 51 | 48MHz | 4K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x12b | External | I2C,LINbus,SCI,SPI,USB | 8-Bit | ||||
NXP USA Inc. |
1,827
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 54 | 40MHz | 2K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
4,619
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 53 | 40MHz | 4K x 8 | 60KB (60K x 8) | 2K x 8 | 2.7 V ~ 5.5 V | A/D 24x12b | External | CANbus,I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
5,523
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | ARM Cortex-M0+ | 57 | 40MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
496
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 105°C (TA) | S08 | 57 | 20MHz | 4K x 8 | 60KB (60K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | I2C,LINbus,SPI,UART/USART | 8-Bit | ||||
NXP USA Inc. |
1,448
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 54 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
800
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 64LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 12V1 | 54 | 25MHz | 8K x 8 | 128KB (128K x 8) | 4K x 8 | 3.13 V ~ 5.5 V | A/D 12x10b | Internal | CANbus,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
798
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 64LQFP
|
Tray | 56F8xxx | -40°C ~ 105°C (TA) | 56800E | 54 | 60MHz | 4K x 16 | 64KB (32K x 16) | - | 3 V ~ 3.6 V | A/D 16x12b,D/A 1x12b | Internal | CANbus,I2C,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
235
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 64LQFP
|
Tray | 56F8xxx | -40°C ~ 125°C (TA) | 56800E | 54 | 60MHz | 4K x 16 | 64KB (32K x 16) | - | 3 V ~ 3.6 V | A/D 16x12b,D/A 1x12b | Internal | CANbus,I2C,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
791
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 58 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | CANbus,I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
546
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 54 | 40MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
361
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 56 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit |