- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- RAM Size：
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- Program Memory Size：
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- Data Converters：
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- Condiciones seleccionadas:
Descubre los productos 38
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Data Converters | Connectivity | |
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NXP USA Inc. |
622
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
889
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 208MAPBGA
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Tray | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | e200z6 | 192 | 80MHz | 64K x 8 | 1MB (1M x 8) | A/D 34x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 324BGA
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Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
200
|
3 dias |
-
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MOQ: 1 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 144MHz | 128K x 8 | 3MB (3M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
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IC MCU 32BIT 1MB FLASH 324TEBGA
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Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 192 | 80MHz | 64K x 8 | 1MB (1M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 1MB FLASH 208MAPBGA
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | e200z6 | 192 | 80MHz | 64K x 8 | 1MB (1M x 8) | A/D 34x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 450 MPQ: 1
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IC MCU 32BIT 1MB FLASH 208MAPBGA
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Tray | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | e200z6 | 192 | 80MHz | 64K x 8 | 1MB (1M x 8) | A/D 34x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
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IC MCU 32BIT 1MB FLASH 324TEBGA
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Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 80MHz | 64K x 8 | 1MB (1M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 450 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 208BGA
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Tray | -40°C ~ 105°C (TA) | 208-BGA | 208-MAPBGA (17x17) | e200z1 | 144 | 80MHz | 80K x 8 | 1.5MB (1.5M x 8) | A/D 40x12b | CANbus，EBI/EMI，I2C，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 324BGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1.5KB FLASH 324BGA
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Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5KB (1.5K x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 82MHz | 64K x 8 | 2MB (2M x 8) | A/D 40x12b | CANbus，EBI/EMI，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | A/D 40x12b | CANbus，EBI/EMI，SCI，SPI | ||
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|
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | A/D 40x12b | CANbus，EBI/EMI，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | A/D 40x12b | CANbus，EBI/EMI，SCI，SPI | ||
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|
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 80MHz | 128K x 8 | 3MB (3M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 80MHz | 128K x 8 | 3MB (3M x 8) | A/D 40x12b | CANbus，EBI/EMI，Ethernet，SCI，SPI |
