- Packaging：
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- Operating Temperature：
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- RAM Size：
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- Program Memory Size：
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- Condiciones seleccionadas:
Descubre los productos 27
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Number of I/O | Speed | RAM Size | Program Memory Size | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Number of I/O | Speed | RAM Size | Program Memory Size | Connectivity | |
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NXP USA Inc. |
622
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
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NXP USA Inc. |
200
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 256 | 144MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
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NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 256 | 82MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI | ||
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|
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256 | 80MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 256 | 80MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256 | 112MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256 | 144MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 256 | 144MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 256 | 144MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tray | -55°C ~ 125°C (TA) | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI |
