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- Voltage - Supply：
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- Operating Temperature：
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Descubre los productos 593
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Controller Series | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Controller Series | |
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Microchip Technology |
948
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4.4MM TSSOP UEK
|
Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
972
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4.4MM TSSOP SEK
|
Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
1,000
|
3 dias |
-
|
MOQ: 1000 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN UEK
|
Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
1,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN UEK
|
Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
1,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN UEK
|
- | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
918
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4.4MM TSSOP UEK
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
1,000
|
3 dias |
-
|
MOQ: 1000 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN SEK
|
Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
1,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN SEK
|
Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
1,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN SEK
|
- | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
976
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4.4MM TSSOP SEK
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
833
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PROD FF COM I2C TPM 4X4 32VQFN C
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
980
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PROD FF COM I2C TPM 4X4 32VQFN U
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
980
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PROD FF COM I2C TPM 4X4 32VQFN S
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
700
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PROD FF IND I2C TPM 4X4 32VQFN C
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
820
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PROD FF IND I2C TPM 4X4 32VQFN U
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
964
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PROD FF IND I2C TPM 4X4 32VQFN S
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
336
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
KEYBOARD AND EMBEDDED CONTROLLER
|
Tray | - | Keyboard and Embedded Controller | ACPI，BC-Link，I2C/SMBus，LPC，PECI，PS/2，SPI，UART | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 132-VFQFN Dual Rows，Exposed Pad | 132-DQFN (11x11) | Surface Mount | ARM® Cortex®-M4 | 116 | 128KB | - | |||
|
|
Cypress Semiconductor Corp |
379
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CCG3
|
Tray | - | - | - | - | - | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Surface Mount | - | - | - | - | |||
|
|
Microchip Technology |
174
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC EMBEDDED CTLR
|
Tray | - | - | - | - | - | 169-LFBGA | 169-LFBGA (11x11) | Surface Mount | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
1,106,000
|
3 dias |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | - | - | - | - | - | - | - | - | - | - | - | - |
