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- Number of I/O：
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- RAM Size：
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- Condiciones seleccionadas:
Descubre los productos 593
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Controller Series | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Controller Series | |
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Microchip Technology |
Consulta
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MOQ: 1000 MPQ: 1
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PROD STD IND I2C TPM 4X4 32VQFN
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Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 1000 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN SEK -
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Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 1000 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN SEK -
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Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 1080 MPQ: 1
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PRODSTD COM I2C TPM 4X4 32VQFN
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Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 5000 MPQ: 1
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FF COM I2C TPM 4X4 32VQFN CEK
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Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 1 MPQ: 1
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FF COM I2C TPM 4X4 32VQFN CEK
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Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 1 MPQ: 1
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FF COM I2C TPM 4X4 32VQFN CEK
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- | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 5000 MPQ: 1
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PRODSTD IND I2C TPM 4X4 32VQFN
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Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | ||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | 4 | - | - | ||
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NXP USA Inc. |
Consulta
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- |
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MOQ: 200 MPQ: 1
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IC MEDIA PROC 180MHZ 292-HBGA
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Tray | - | Multimedia | I2C，2-Wire Serial | 2.375 V ~ 2.625 V | 0°C ~ 85°C | 292-HBGA | 292-BGA | Surface Mount | TriMedia® | 169 | 48K x 8 | Nexperia | ||
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NXP USA Inc. |
Consulta
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MOQ: 200 MPQ: 1
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IC MEDIA PROC 200MHZ 292-HBGA
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Tray | - | Multimedia | I2C，2-Wire Serial | 2.375 V ~ 2.625 V | 0°C ~ 85°C | 292-HBGA | 292-BGA | Surface Mount | TriMedia® | 169 | 48K x 8 | Nexperia | ||
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NXP USA Inc. |
Consulta
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-
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MOQ: 200 MPQ: 1
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IC MEDIA PROC 266MHZ 456-BGA
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Tray | PNX15xx | Multimedia | I2C，2-Wire Serial | 1.14 V ~ 1.26 V | 0°C ~ 85°C | 456-BGA | 456-PBGA (27x27) | Surface Mount | TM3260 | 61 | - | Nexperia | ||
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NXP USA Inc. |
Consulta
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MOQ: 200 MPQ: 1
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IC MEDIA PROC 300MHZ 456-BGA
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Tray | PNX15xx | Multimedia | I2C，2-Wire Serial | 1.23 V ~ 1.37 V | 0°C ~ 85°C | 456-BGA | 456-PBGA (27x27) | Surface Mount | TM3260 | 61 | - | Nexperia |
