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- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Supplier Device Package：
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Descubre los productos 593
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Controller Series | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Controller Series | |
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Microchip Technology |
Consulta
|
- |
-
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MOQ: 1000 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN CEK
|
Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
988
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN CEK
|
Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
988
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN CEK
|
- | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
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Microchip Technology |
Consulta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN UEK
|
Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
1,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN UEK
|
Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
Consulta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN SEK
|
Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
971
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN SEK
|
Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
971
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN SEK
|
- | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
Consulta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
|
Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
711
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
|
Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
711
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
|
- | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Cypress Semiconductor Corp |
Consulta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
CCG4
|
Tape & Reel (TR) | - | - | - | - | - | 40-UFQFN Exposed Pad | - | Surface Mount | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
1,557
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CCG4
|
Cut Tape (CT) | - | - | - | - | - | 40-UFQFN Exposed Pad | - | Surface Mount | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
1,557
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CCG4
|
- | - | - | - | - | - | 40-UFQFN Exposed Pad | - | Surface Mount | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
9,763
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC CAPSENSE 32KB FLASH 48QFN
|
Tray | - | - | - | - | - | 48-UFQFN Exposed Pad | 48-QFN (6x6) | Surface Mount | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
1,040
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC TRUETOUCH CAPSENSE 56VQFN
|
Tray | - | - | - | - | - | 56-VFQFN Exposed Pad | 56-QFN (8x8) | Surface Mount | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
931
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC USB HOST/SLAVE CTRLR 48TQFP
|
Tray | - | USB Host/Slave Controller | USB | 3 V ~ 3.6 V | 0°C ~ 65°C | 48-LQFP | 48-TQFP (7x7) | Surface Mount | - | 8 | 256 x 8 | USB-Hosts | |||
|
|
Cypress Semiconductor Corp |
361
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC USB CTLR
|
Tray | EZ-USB SD3 | SD3® USB and Mass Storage Peripheral Controller | I2C，I2S，MMC/SD，SPI，UART，USB | 1.15 V ~ 1.25 V | -40°C ~ 85°C | 121-TFBGA | 121-FBGA (10x10) | Surface Mount | ARM9® | 59 | 512K x 8 | CYUSB | |||
|
|
Microchip Technology |
677
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PRODSTD COM SPI TPM 4X4 32VQFN
|
Tray | - | Trusted Platform Module (TPM) | SPI | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | |||
|
|
Microchip Technology |
123
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PRODSTD IND SPI TPM 4X4 32VQFN
|
Tray | - | Trusted Platform Module (TPM) | SPI | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - |
