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- Interface:
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Descubre los productos 5
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | ||
4D Systems Pty Ltd |
299
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC GRAPHICS CTLR EMB 64TQFP
|
Tray | Graphics Processor | I2C,LCD,OLED,SD,SPI,TFT,TTL | 3 V ~ 3.6 V | -40°C ~ 80°C | 64-TQFP | 64-TQFP (10x10) | EVE | 16 | 32K x 8 | ||||
Microchip Technology |
176
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC EMBEDDED CTLR 169LFBGA
|
Tray | I/O Controller | ACPI,BC-Link,I2C/SMBus,LPC,PECI,PS/2,SPI | 3.3V | 0°C ~ 85°C | 169-LFBGA | 169-LFBGA (11x11) | ARC-625D | 135 | 16kB | ||||
Microchip Technology |
Consulta
|
- |
-
|
MOQ: 240 MPQ: 1
|
MIXED SIGNAL MOBILE EMBEDDED CON
|
Tube | I/O Controller | ACPI,BC-Link,I2C/SMBus,LPC,PECI,PS/2,SPI,VLPC | 3.3V | -40°C ~ 85°C | 144-LFBGA | 144-LFBGA (10x10) | ARC-625D | 115 | 16kB | ||||
Microchip Technology |
240
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC EMBEDDED CTLR
|
Tray | I/O Controller | ACPI,BC-Link,I2C/SMBus,LPC,PECI,PS/2,SPI,VLPC | 3.3V | 0°C ~ 70°C | 144-LFBGA | 144-LFBGA (10x10) | ARC-625D | 115 | 16kB | ||||
Microchip Technology |
Consulta
|
- |
-
|
MOQ: 240 MPQ: 1
|
IC EMBEDDED CTLR 144TFBGA
|
Tray | I/O Controller | ACPI,BC-Link,I2C/SMBus,LPC,PECI,PS/2,SPI,VLPC | 3.3V | 0°C ~ 70°C | 144-TFBGA | 144-TFBGA (7x7) | ARC-625D | 115 | 16kB |