Embedded - FPGAs (Field Programmable Gate Array) - Zui Ai Technology（Taiwan）Company.

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La imagen	Número de pieza	Fabricante	Cantidad	Plazo de entrega	Precio unitario	Comprar	Descripción	Operating Temperature	Package / Case	Supplier Device Package	Number of I/O
La imagen	Número de pieza	Fabricante	Cantidad	Plazo de entrega	Precio unitario	Comprar	Descripción	Operating Temperature	Package / Case	Supplier Device Package	Number of I/O
	XCV300-4FG456C	Xilinx Inc.	Consulta	-	-	IC FPGA 312 I/O 456FBGA MOQ: 60 MPQ: 1	IC FPGA 312 I/O 456FBGA	0°C ~ 85°C (TJ)	456-BBGA	456-FBGA (23x23)	312
	XCV300-4FG456I	Xilinx Inc.	Consulta	-	-	IC FPGA 312 I/O 456FBGA MOQ: 3 MPQ: 1	IC FPGA 312 I/O 456FBGA	-40°C ~ 100°C (TJ)	456-BBGA	456-FBGA (23x23)	312
	XCV300-5FG456C	Xilinx Inc.	Consulta	-	-	IC FPGA 312 I/O 456FBGA MOQ: 3 MPQ: 1	IC FPGA 312 I/O 456FBGA	0°C ~ 85°C (TJ)	456-BBGA	456-FBGA (23x23)	312
	XCV300-5FG456I	Xilinx Inc.	Consulta	-	-	IC FPGA 312 I/O 456FBGA MOQ: 2 MPQ: 1	IC FPGA 312 I/O 456FBGA	-40°C ~ 100°C (TJ)	456-BBGA	456-FBGA (23x23)	312
	XCV300-6FG456C	Xilinx Inc.	Consulta	-	-	IC FPGA 312 I/O 456FBGA MOQ: 2 MPQ: 1	IC FPGA 312 I/O 456FBGA	0°C ~ 85°C (TJ)	456-BBGA	456-FBGA (23x23)	312
	XCV300-4BG352C	Xilinx Inc.	Consulta	-	-	IC FPGA 260 I/O 352MBGA MOQ: 24 MPQ: 1	IC FPGA 260 I/O 352MBGA	0°C ~ 85°C (TJ)	352-LBGA Exposed Pad，Metal	352-MBGA (35x35)	260
	XCV300-4BG352I	Xilinx Inc.	Consulta	-	-	IC FPGA 260 I/O 352MBGA MOQ: 3 MPQ: 1	IC FPGA 260 I/O 352MBGA	-40°C ~ 100°C (TJ)	352-LBGA Exposed Pad，Metal	352-MBGA (35x35)	260
	XCV300-4BG432C	Xilinx Inc.	Consulta	-	-	IC FPGA 316 I/O 432MBGA MOQ: 21 MPQ: 1	IC FPGA 316 I/O 432MBGA	0°C ~ 85°C (TJ)	432-LBGA Exposed Pad，Metal	432-MBGA (40x40)	316
	XCV300-4BG432I	Xilinx Inc.	Consulta	-	-	IC FPGA 316 I/O 432MBGA MOQ: 3 MPQ: 1	IC FPGA 316 I/O 432MBGA	-40°C ~ 100°C (TJ)	432-LBGA Exposed Pad，Metal	432-MBGA (40x40)	316
	XCV300-4PQ240C	Xilinx Inc.	Consulta	-	-	IC FPGA 166 I/O 240QFP MOQ: 24 MPQ: 1	IC FPGA 166 I/O 240QFP	0°C ~ 85°C (TJ)	240-BFQFP	240-PQFP (32x32)	166
	XCV300-4PQ240I	Xilinx Inc.	Consulta	-	-	IC FPGA 166 I/O 240QFP MOQ: 3 MPQ: 1	IC FPGA 166 I/O 240QFP	-40°C ~ 100°C (TJ)	240-BFQFP	240-PQFP (32x32)	166
	XCV300-5BG352C	Xilinx Inc.	Consulta	-	-	IC FPGA 260 I/O 352MBGA MOQ: 3 MPQ: 1	IC FPGA 260 I/O 352MBGA	0°C ~ 85°C (TJ)	352-LBGA Exposed Pad，Metal	352-MBGA (35x35)	260
	XCV300-5BG352I	Xilinx Inc.	Consulta	-	-	IC FPGA 260 I/O 352MBGA MOQ: 2 MPQ: 1	IC FPGA 260 I/O 352MBGA	-40°C ~ 100°C (TJ)	352-LBGA Exposed Pad，Metal	352-MBGA (35x35)	260
	XCV300-5BG432C	Xilinx Inc.	Consulta	-	-	IC FPGA 316 I/O 432MBGA MOQ: 3 MPQ: 1	IC FPGA 316 I/O 432MBGA	0°C ~ 85°C (TJ)	432-LBGA Exposed Pad，Metal	432-MBGA (40x40)	316
	XCV300-5BG432I	Xilinx Inc.	Consulta	-	-	IC FPGA 316 I/O 432MBGA MOQ: 2 MPQ: 1	IC FPGA 316 I/O 432MBGA	-40°C ~ 100°C (TJ)	432-LBGA Exposed Pad，Metal	432-MBGA (40x40)	316
	XCV300-5PQ240C	Xilinx Inc.	Consulta	-	-	IC FPGA 166 I/O 240QFP MOQ: 3 MPQ: 1	IC FPGA 166 I/O 240QFP	0°C ~ 85°C (TJ)	240-BFQFP	240-PQFP (32x32)	166
	XCV300-5PQ240I	Xilinx Inc.	Consulta	-	-	IC FPGA 166 I/O 240QFP MOQ: 3 MPQ: 1	IC FPGA 166 I/O 240QFP	-40°C ~ 100°C (TJ)	240-BFQFP	240-PQFP (32x32)	166
	XCV300-6BG352C	Xilinx Inc.	Consulta	-	-	IC FPGA 260 I/O 352MBGA MOQ: 2 MPQ: 1	IC FPGA 260 I/O 352MBGA	0°C ~ 85°C (TJ)	352-LBGA Exposed Pad，Metal	352-MBGA (35x35)	260
	XCV300-6BG432C	Xilinx Inc.	Consulta	-	-	IC FPGA 316 I/O 432MBGA MOQ: 2 MPQ: 1	IC FPGA 316 I/O 432MBGA	0°C ~ 85°C (TJ)	432-LBGA Exposed Pad，Metal	432-MBGA (40x40)	316
	XCV300-6PQ240C	Xilinx Inc.	Consulta	-	-	IC FPGA 166 I/O 240QFP MOQ: 2 MPQ: 1	IC FPGA 166 I/O 240QFP	0°C ~ 85°C (TJ)	240-BFQFP	240-PQFP (32x32)	166