Package / Case:
Supplier Device Package:
Number of I/O:
Descubre los productos 14
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Operating Temperature Package / Case Supplier Device Package Number of I/O
EP3CLS200F484C8N
Intel
Consulta
-
-
MOQ: 5  MPQ: 1
IC FPGA 210 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 210
EP3CLS200F780C8N
Intel
Consulta
-
-
MOQ: 4  MPQ: 1
IC FPGA 413 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 413
EP3CLS200F484C8
Intel
Consulta
-
-
MOQ: 5  MPQ: 1
IC FPGA 210 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 210
EP3CLS200F780C8
Intel
Consulta
-
-
MOQ: 4  MPQ: 1
IC FPGA 413 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 413
EP3CLS200F484C7N
Intel
Consulta
-
-
MOQ: 5  MPQ: 1
IC FPGA 210 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 210
EP3CLS200F484C7
Intel
Consulta
-
-
MOQ: 5  MPQ: 1
IC FPGA 210 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 210
EP3CLS200F780C7N
Intel
Consulta
-
-
MOQ: 4  MPQ: 1
IC FPGA 413 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 413
EP3CLS200F484I7N
Intel
Consulta
-
-
MOQ: 5  MPQ: 1
IC FPGA 210 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 210
EP3CLS200F780C7
Intel
Consulta
-
-
MOQ: 4  MPQ: 1
IC FPGA 413 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 413
EP3CLS200F484I7
Intel
Consulta
-
-
MOQ: 5  MPQ: 1
IC FPGA 210 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 210
EP3CLS200F780I7N
Intel
Consulta
-
-
MOQ: 4  MPQ: 1
IC FPGA 413 I/O 780FBGA
-40°C ~ 100°C (TJ) 780-BGA 780-FBGA (29x29) 413
EP3CLS200F780I7
Intel
Consulta
-
-
MOQ: 4  MPQ: 1
IC FPGA 413 I/O 780FBGA
-40°C ~ 100°C (TJ) 780-BGA 780-FBGA (29x29) 413
EP3CLS200F780C8ES
Intel
Consulta
-
-
MOQ: 4  MPQ: 1
IC FPGA 413 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 413
EP3CLS200F484C8ES
Intel
Consulta
-
-
MOQ: 5  MPQ: 1
IC FPGA 210 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 210