Supplier Device Package:
Number of LABs/CLBs:
Number of Logic Elements/Cells:
Total RAM Bits:
Descubre los productos 10
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Operating Temperature Package / Case Supplier Device Package Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
XCKU3P-1SFVB784I
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
XCKU3P-1SFVB784I
-40°C ~ 100°C (TJ) 784-BBGA,FCBGA 784-FCBGA (23x23) 20340 355950 31641600
XCKU5P-1FFVA676E
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
IC FPGA 256 I/O 676FCBGA
0°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 27120 474600 41984000
XCKU5P-1FFVA676I
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
IC FPGA 256 I/O 676FCBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 27120 474600 41984000
XCKU5P-2FFVA676E
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
XCKU5P-2FFVA676E
0°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 27120 474600 41984000
XCKU5P-2FFVA676I
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
IC FPGA 256 I/O 676FCBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 27120 474600 41984000
XCKU5P-3FFVA676E
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
IC FPGA 256 I/O 676FCBGA
0°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 27120 474600 41984000
XCKU3P-1FFVA676E
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
XCKU3P-1FFVA676E
0°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 20340 355950 31641600
XCKU3P-1FFVA676I
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
XCKU3P-1FFVA676I
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 20340 355950 31641600
XCKU3P-2FFVA676E
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
XCKU3P-2FFVA676E
0°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 20340 355950 31641600
XCKU3P-2FFVA676I
Xilinx Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
XCKU3P-2FFVA676I
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 20340 355950 31641600