Descubre los productos 7
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Packaging Package / Case Supplier Device Package Input
SY58608UMG-TR
Microchip Technology
1,000
3 dias
-
MOQ: 1000  MPQ: 1
IC CLK BUFFER 1:2 3GHZ 16MLF
Tape & Reel (TR) 16-VFQFN Exposed Pad,16-MLF? 16-MLF? (3x3) CML,LVDS,LVPECL
SY58608UMG-TR
Microchip Technology
1,911
3 dias
-
MOQ: 1  MPQ: 1
IC CLK BUFFER 1:2 3GHZ 16MLF
Cut Tape (CT) 16-VFQFN Exposed Pad,16-MLF? 16-MLF? (3x3) CML,LVDS,LVPECL
SY58608UMG-TR
Microchip Technology
1,911
3 dias
-
MOQ: 1  MPQ: 1
IC CLK BUFFER 1:2 3GHZ 16MLF
- 16-VFQFN Exposed Pad,16-MLF? 16-MLF? (3x3) CML,LVDS,LVPECL
SY58608UMG
Microchip Technology
2,160
3 dias
-
MOQ: 1  MPQ: 1
IC CLK BUFFER 1:2 3GHZ 16MLF
Tube 16-VFQFN Exposed Pad,16-MLF? 16-MLF? (3x3) CML,LVDS,LVPECL
SY89835UMG-TR
Microchip Technology
Consulta
-
-
MOQ: 1000  MPQ: 1
IC CLK BUFFER 1:2 3GHZ 8MLF
Tape & Reel (TR) 8-VFDFN Exposed Pad,8-MLF? 8-MLF? (2x2) LVDS
SY89835UMG-TR
Microchip Technology
302
3 dias
-
MOQ: 1  MPQ: 1
IC CLK BUFFER 1:2 3GHZ 8MLF
Cut Tape (CT) 8-VFDFN Exposed Pad,8-MLF? 8-MLF? (2x2) LVDS
SY89835UMG-TR
Microchip Technology
302
3 dias
-
MOQ: 1  MPQ: 1
IC CLK BUFFER 1:2 3GHZ 8MLF
- 8-VFDFN Exposed Pad,8-MLF? 8-MLF? (2x2) LVDS