- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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CUI Inc. |
1,467
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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0.984" (25.00mm) | 1.359" (34.50mm) | TO-220 | 0.492" (12.50mm) | 5.5W @ 75°C | 13.64°C/W | ||
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CUI Inc. |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220/TO-
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1.500" (38.10mm) | 0.650" (16.50mm) | TO-218, TO-220 | 0.630" (16.00mm) | 5.9W @ 75°C | 12.71°C/W |
