- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.915" (23.24mm) | 1.5W @ 40°C | 6.00°C/W @ 600 LFM | 16.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.845" (21.46mm) | 2.0W @ 50°C | 6.00°C/W @ 400 LFM | 20.60°C/W |
