Térmico - Disipadores de calor - Zui Ai Technology（Taiwan）Company.

Type：

Shape：

Length：

Width：

Attachment Method：

Package Cooled：

Height Off Base (Height of Fin)：

Power Dissipation @ Temperature Rise：

10.0W @ 75°C (2)
10.8W @ 75°C (1)
11.7W @ 75°C (1)
12.0W @ 75°C (3)
12.2W @ 75°C (1)
12.8W @ 75°C (3)
13.0W @ 75°C (1)
13.7W @ 75°C (1)
14.4W @ 75°C (1)
15.1W @ 75°C (1)
16.7W @ 75°C (2)
3.1W @ 75°C (1)
3.7W @ 75°C (1)
3.8W @ 75°C (1)
4.7W @ 75°C (1)
5.0W @ 75°C (1)
5.2W @ 75°C (1)
5.5W @ 75°C (3)
5.7W @ 75°C (1)
5.8W @ 75°C (1)
5.9W @ 75°C (1)
6.0W @ 75°C (1)
6.2W @ 75°C (1)
6.4W @ 75°C (1)
6.5W @ 75°C (2)
6.7W @ 75°C (1)
6.9W @ 75°C (1)
7.0W @ 75°C (1)
7.3W @ 75°C (1)
7.4W @ 75°C (1)
7.7W @ 75°C (1)
7.8W @ 75°C (2)
8.0W @ 75°C (1)
8.1W @ 75°C (2)
8.2W @ 75°C (2)
8.9W @ 75°C (2)
9.1W @ 75°C (2)
9.2W @ 75°C (2)
9.3W @ 75°C (1)
9.4W @ 75°C (1)
9.6W @ 75°C (1)
9.8W @ 75°C (1)
9.9W @ 75°C (1)

Thermal Resistance @ Forced Air Flow：

Thermal Resistance @ Natural：

10.14°C/W (1)
10.27°C/W (1)
10.71°C/W (1)
10.87°C/W (1)
11.19°C/W (1)
11.54°C/W (2)
11.72°C/W (1)
12.10°C/W (1)
12.50°C/W (1)
12.71°C/W (1)
12.93°C/W (1)
13.16°C/W (1)
13.64°C/W (3)
14.42°C/W (1)
15.00°C/W (1)
15.96°C/W (1)
19.74°C/W (1)
20.27°C/W (1)
24.19°C/W (1)
4.49°C/W (2)
4.97°C/W (1)
5.21°C/W (1)
5.47°C/W (1)
5.77°C/W (1)
5.86°C/W (3)
6.15°C/W (1)
6.25°C/W (3)
6.41°C/W (1)
6.94°C/W (1)
7.50°C/W (2)
7.58°C/W (1)
7.65°C/W (1)
7.81°C/W (1)
7.98°C/W (1)
8.06°C/W (1)
8.15°C/W (2)
8.24°C/W (2)
8.43°C/W (2)
9.15°C/W (2)
9.26°C/W (2)
9.38°C/W (1)
9.62°C/W (2)
9.74°C/W (1)

La imagen	Número de pieza	Fabricante	Cantidad	Plazo de entrega	Precio unitario	Comprar	Descripción	Type	Shape	Length	Width	Attachment Method	Package Cooled	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural
La imagen	Número de pieza	Fabricante	Cantidad	Plazo de entrega	Precio unitario	Comprar	Descripción	Type	Shape	Length	Width	Attachment Method	Package Cooled	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural
	HSE-B20635-035H-01	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-220, 63 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-220, 63	Board Level, Vertical	Rectangular, Fins	2.500" (63.50mm)	1.378" (35.00mm)	PC Pin	TO-220	0.500" (12.70mm)	9.4W @ 75°C	4.49°C/W @ 200 LFM	7.98°C/W
	HSE-B508-045H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-220, 50 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-220, 50	Board Level, Vertical	Rectangular, Fins	2.000" (50.80mm)	1.772" (45.00mm)	PC Pin	TO-220	0.500" (12.70mm)	9.3W @ 75°C	4.38°C/W @ 200 LFM	8.06°C/W
	HSE-B20635-035H-W	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-220, 63 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-220, 63	Board Level, Vertical	Rectangular, Fins	2.500" (63.50mm)	1.378" (35.00mm)	PC Pin	TO-220	0.500" (12.70mm)	9.2W @ 75°C	4.35°C/W @ 200 LFM	8.15°C/W
	HSE-B18317-035H-01	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 31 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 31	Board Level, Vertical	Rectangular, Fins	1.250" (31.75mm)	1.638" (41.60mm)	PC Pin	TO-218	0.984" (25.00mm)	10.0W @ 75°C	4.33°C/W @ 200 LFM	7.50°C/W
	HSE-B18381-035H-02	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 38 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 38	Board Level, Vertical	Rectangular, Fins	1.500" (38.10mm)	1.638" (41.60mm)	PC Pin	TO-218	0.984" (25.00mm)	12.0W @ 75°C	3.79°C/W @ 200 LFM	6.25°C/W
	HSE-B500-04H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-220, 50 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-220, 50	Board Level, Vertical	Rectangular, Fins	1.969" (50.00mm)	1.378" (35.00mm)	PC Pin	TO-220	1.000" (25.40mm)	12.2W @ 75°C	2.88°C/W @ 200 LFM	6.15°C/W
	HSE-B18508-035H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 50 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 50	Board Level, Vertical	Rectangular, Fins	2.000" (50.80mm)	1.638" (41.60mm)	PC Pin	TO-218	0.984" (25.00mm)	12.8W @ 75°C	2.98°C/W @ 200 LFM	5.86°C/W
	HSE-B18508-060H-W	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION,TO-218, 50. MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION,TO-218, 50.	Board Level, Vertical	Rectangular, Fins	2.000" (50.80mm)	1.638" (41.60mm)	PC Pin	TO-218	0.984" (25.00mm)	12.8W @ 75°C	2.98°C/W @ 200 LFM	5.86°C/W
	HSE-B18318-0396H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION,TO-218, 31. MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION,TO-218, 31.	Board Level, Vertical	Rectangular, Fins	1.250" (31.75mm)	1.654" (42.00mm)	PC Pin	TO-218	0.984" (25.00mm)	9.1W @ 75°C	2.57°C/W @ 200 LFM	8.24°C/W
	HSE-B18508-035H-03	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 50 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 50	Board Level, Vertical	Rectangular, Fins	2.000" (50.80mm)	1.638" (41.60mm)	PC Pin	TO-218	0.984" (25.00mm)	13.0W @ 75°C	3.44°C/W @ 200 LFM	5.77°C/W
	HSE-B630-04H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-220, 63 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-220, 63	Board Level, Vertical	Rectangular, Fins	2.480" (63.00mm)	1.378" (35.00mm)	PC Pin	TO-220	1.000" (25.40mm)	14.4W @ 75°C	2.31°C/W @ 200 LFM	5.21°C/W
	HSE-B18635-035H-04	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 63 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 63	Board Level, Vertical	Rectangular, Fins	2.500" (63.50mm)	1.638" (41.60mm)	PC Pin	TO-218	0.984" (25.00mm)	15.1W @ 75°C	2.38°C/W @ 200 LFM	4.97°C/W
	HSE-B18635-035H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION,TO-218, 63. MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION,TO-218, 63.	Board Level, Vertical	Rectangular, Fins	2.500" (63.50mm)	1.638" (41.60mm)	PC Pin	TO-218	0.984" (25.00mm)	16.7W @ 75°C	2.24°C/W @ 200 LFM	4.49°C/W
	HSE-B18381-0396H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 38 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 38	Board Level, Vertical	Rectangular, Fins	1.500" (38.10mm)	1.654" (42.00mm)	PC Pin	TO-218	0.984" (25.00mm)	10.8W @ 75°C	2.29°C/W @ 200 LFM	6.94°C/W
	HSE-B635-045H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-220, 63 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-220, 63	Board Level, Vertical	Rectangular, Fins	2.500" (63.50mm)	1.772" (45.00mm)	PC Pin	TO-220	0.500" (12.70mm)	11.7W @ 75°C	3.53°C/W @ 200 LFM	6.41°C/W
	HSE-B18635-060H-W	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 63 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 63	Board Level, Vertical	Rectangular, Fins	2.500" (63.50mm)	1.638" (41.60mm)	PC Pin	TO-218	0.984" (25.00mm)	16.7W @ 75°C	2.24°C/W @ 200 LFM	4.49°C/W
	HSE-B18508-0396H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 50 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 50	Board Level, Vertical	Rectangular, Fins	2.000" (50.80mm)	1.654" (42.00mm)	PC Pin	TO-218	0.984" (25.00mm)	12.8W @ 75°C	2.45°C/W @ 200 LFM	5.86°C/W
	HSE-B18635-0396H	CUI Inc.	Consulta	-	-	HEAT SINK, EXTRUSION, TO-218, 63 MOQ: 1 MPQ: 1	HEAT SINK, EXTRUSION, TO-218, 63	Board Level, Vertical	Rectangular, Fins	2.500" (63.50mm)	1.654" (42.00mm)	PC Pin	TO-218	0.984" (25.00mm)	13.7W @ 75°C	2.78°C/W @ 200 LFM	5.47°C/W

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