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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 12,474
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
948
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 35MM SQ H=.45" BLK
|
642 | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | 6.00°C/W @ 500 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
40
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 12.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | - | 3.00°C/W @ 200 LFM | - | Blue Anodized | |||
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ASSMANN WSW Components |
410
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | 11.00°C/W | Black Anodized | ||
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Ohmite |
34
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220 BLACK
|
E | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 6.0W @ 40°C | 4.00°C/W @ 500 LFM | 8.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
82
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 7.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 5.30°C/W @ 200 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
26
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 4.20°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
76
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 3.10°C/W @ 200 LFM | - | Black Anodized | |||
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|
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ASSMANN WSW Components |
838
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.185" (55.50mm) | Bolt On and Board Mounts | TO-220 | 0.500" (12.70mm) | - | - | 14.00°C/W | Tin | ||
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|
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ASSMANN WSW Components |
592
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | 7.00°C/W | Black Anodized | ||
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|
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Ohmite |
100
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220
|
E | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 5.0W @ 40°C | 4.00°C/W @ 600 LFM | 9.40°C/W | Degreased | ||
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Ohmite |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220
|
E | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 6.0W @ 40°C | 4.00°C/W @ 500 LFM | 10.00°C/W | Degreased | ||
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Advanced Thermal Solutions Inc. |
71
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 35X35X10MM R-TAB FP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | - | 23.98°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
72
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 35X35X15MM L-TAB FP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 17.72°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
90
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X15MM L-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 8.59°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
53
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X15MM R-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 8.59°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
96
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 35X35X20MM R-TAB FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | - | 13.16°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
78
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X25MM R-TAB FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | - | 10.11°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
63
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X25MM R-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | - | 4.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
75
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X30MM L-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.181" (30.00mm) | - | 3.93°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
46
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X35MM L-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.378" (35.00mm) | - | 3.32°C/W @ 100 LFM | - | Blue Anodized |
