- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
1,136
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
PC Pin | SOT-32, TO-220, TOP-3 | - | - | 11.00°C/W | ||
|
|
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ASSMANN WSW Components |
293
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Bolt On and PC Pin | TO-220 | - | - | 11.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Bolt On and PC Pin | TO-220 | 7.0W @ 70°C | 4.00°C/W @ 300 LFM | 10.40°C/W |
