- Series：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
Descubre los productos 6
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
Advanced Thermal Solutions Inc. |
132
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 19.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | Clip, Thermal Material | - | 5.00°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
768
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 19.5MM
|
maxiGRIP | Square, Fins | Clip, Thermal Material | - | 7.30°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
54
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 19.5MM
|
- | Square, Fins | Thermal Tape, Adhesive (Included) | 0.3W @ 20°C | 7.30°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 19.5MM
|
- | Square, Fins | Thermal Tape, Adhesive (Included) | - | 7.80°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 23X23X19.5MM W/OUT TIM
|
- | Square, Fins | Thermal Tape, Adhesive (Not Included) | 0.3W @ 20°C | 7.30°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 23X23X19.5MM W/OUT TIM
|
- | Square, Fins | Thermal Tape, Adhesive (Not Included) | - | 7.80°C/W @ 200 LFM |
