- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Attachment Method | Power Dissipation @ Temperature Rise | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Attachment Method | Power Dissipation @ Temperature Rise | |
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Aavid, Thermal Division of Boyd Corporation |
2,809
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLK
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Board Level | Rectangular, Fins | Clip | 1.5W @ 40°C | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | Clip and PC Pin | 1.5W @ 40°C | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular | Clip and PC Pin | 2.0W @ 50°C |
