- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
4,336
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN/CLIP
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1.500" (38.10mm) | Clip and PC Pin | 2.00°C/W @ 500 LFM | 5.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
2,040
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 10W H=1.5" BLK
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1.500" (38.10mm) | Bolt On | 2.00°C/W @ 500 LFM | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.000" (50.80mm) | Bolt On and PC Pin | 1.00°C/W @ 700 LFM | 3.30°C/W |
