- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
1,969
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218/TO-220 PIN
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1.000" (25.40mm) | 4.0W @ 30°C | 1.50°C/W @ 600 LFM | 5.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.000" (25.40mm) | 6.0W @ 50°C | 3.50°C/W @ 200 LFM | 6.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.500" (38.10mm) | 6.0W @ 50°C | 3.50°C/W @ 200 LFM | 5.80°C/W |
