- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
-
- Condiciones seleccionadas:
Descubre los productos 6
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Ohmite |
493
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 2.0"
|
F | Aluminum | Bolt On and PC Pin | TO-220 | 4.0W @ 20°C | 2.00°C/W @ 300 LFM | 3.40°C/W | ||||
ASSMANN WSW Components |
774
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Aluminum | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | 4.00°C/W | ||||
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 50
|
HSE | Aluminum Alloy | PC Pin | TO-218 | 12.8W @ 75°C | 2.98°C/W @ 200 LFM | 5.86°C/W | ||||
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION,TO-218, 50.
|
HSE | Aluminum Alloy | PC Pin | TO-218 | 12.8W @ 75°C | 2.98°C/W @ 200 LFM | 5.86°C/W | ||||
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 50
|
HSE | Aluminum Alloy | PC Pin | TO-218 | 13.0W @ 75°C | 3.44°C/W @ 200 LFM | 5.77°C/W | ||||
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK EXTRUDED 25X41.6X50.8MM
|
- | Aluminum | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 6.0W @ 30°C | 1.50°C/W @ 500 LFM | - |