- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
1,584
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | - | 1.380" (35.05mm) | 2.0W @ 30°C | 5.00°C/W @ 200 LFM | Tin | ||
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Ohmite |
100
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220
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E | Board Level, Vertical | Aluminum | 1.378" (35.00mm) | 5.0W @ 40°C | 4.00°C/W @ 600 LFM | Degreased | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | 1.380" (35.05mm) | 1.0W @ 20°C | 5.00°C/W @ 200 LFM | Black Anodized |
