- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 7
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,975
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 2"
|
Board Level, Vertical | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 1.50°C/W @ 500 LFM | 4.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | 1.650" (41.91mm) | Bolt On | TO-218 | 1.000" (25.40mm) | 1.00°C/W @ 800 LFM | 4.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | 1.650" (41.91mm) | Bolt On | TO-220 | 1.000" (25.40mm) | 1.50°C/W @ 500 LFM | 4.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 1.50°C/W @ 500 LFM | 4.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.650" (41.91mm) | Clip and PC Pin | TO-220 | 1.000" (25.40mm) | 1.00°C/W @ 800 LFM | 4.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.650" (41.91mm) | Clip and PC Pin | TO-220 (Dual) | 1.000" (25.40mm) | 1.00°C/W @ 800 LFM | 2.70°C/W | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK EXTRUDED 25X41.6X50.8MM
|
Board Level, Vertical | 1.638" (41.60mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 0.984" (25.00mm) | 1.50°C/W @ 500 LFM | - |
