- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
1,343
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218/TO-247 W/PINS 2"
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1.375" (34.93mm) | TO-218, TO-247 | 0.500" (12.70mm) | 3.00°C/W @ 400 LFM | 8.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.650" (41.91mm) | TO-218, TO-220, TO-247, Multiwatt (Dual) | 1.000" (25.40mm) | 3.50°C/W @ 200 LFM | 4.20°C/W | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 12.7X34.9X50.8MM
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1.375" (34.93mm) | TO-218, TO-220, TO-247 | 0.500" (12.70mm) | 4.50°C/W @ 200 LFM | - |
