- Series:
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- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 12,444
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
302
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 12.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | Clip, Thermal Material | BGA | 0.492" (12.50mm) | 3.00°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
1,865
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 19.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 2.20°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
1,290
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 35X35X12.5MM
|
maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | Clip, Thermal Material | BGA | 0.492" (12.50mm) | 3.00°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
3,784
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 10.30°C/W @ 200 LFM | - | Black Anodized | ||||
Wakefield-Vette |
2,281
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X12MM ELLIPTICAL
|
908 | Top Mount | Aluminum | Square, Fins | Clip | BGA | 0.457" (11.60mm) | 3.10°C/W @ 200 LFM | 11.10°C/W | Black Anodized | ||||
Sunon Fans |
367
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X20MM W/ADH
|
- | Top Mount | Aluminum | Square, Pin Fins | Thermal Tape, Adhesive (Included) | - | 0.790" (20.00mm) | - | - | - | ||||
Wakefield-Vette |
134
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X23MM PIN
|
908 | Top Mount | Aluminum | Square, Pin Fins | Clip | BGA | 0.892" (22.65mm) | 2.10°C/W @ 200 LFM | 8.80°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
522
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Fins | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 3.80°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
163
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Fins | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 2.90°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
574
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 17.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | 2.30°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
604
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 5.30°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
118
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X10MM L-TAB FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 23.98°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
155
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X10MM R-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 13.52°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
235
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X20MM R-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 6.21°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
129
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X25MM L-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 4.82°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
146
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X35MM R-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.378" (35.00mm) | 3.32°C/W @ 100 LFM | - | Blue Anodized | ||||
Wakefield-Vette |
191
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X12MM PIN
|
908 | Top Mount | Aluminum | Square, Pin Fins | Clip | BGA | 0.457" (11.60mm) | 3.10°C/W @ 200 LFM | 11.10°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
183
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 11.30°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
985
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
maxiGRIP | Top Mount | Aluminum | Square, Fins | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 10.30°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
1,714
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 19.5MM
|
maxiGRIP | Top Mount | Aluminum | Square, Fins | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 3.80°C/W @ 200 LFM | - | Black Anodized |