Fabricante:
Series:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
581002B02500G
Aavid, Thermal Division of Boyd Corporation
8,391
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 PWR BLK W/PINS
- Board Level, Vertical Bolt On and PC Pin TO-220 2.5W @ 50°C 4.00°C/W @ 500 LFM 17.40°C/W
581002B00000
Aavid, Thermal Division of Boyd Corporation
2,678
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 4.3W H=1.0 BLK
- Board Level Bolt On TO-220 2.5W @ 50°C 4.00°C/W @ 500 LFM -
634-10ABPE
Wakefield-Vette
2,830
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 VERT MT BLK 1"
634 Board Level, Vertical Bolt On and PC Pin TO-220 - - -
634-10AB
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 VERT MT BLK 1"
634 Board Level, Vertical Bolt On TO-220, TO-218 - - -
581002B02100G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical Bolt On and PC Pin TO-220 4.0W @ 70°C 4.00°C/W @ 500 LFM 17.40°C/W
634-10ABP
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 VERT MT BLK 1"
634 Board Level, Vertical Bolt On and PC Pin TO-220, TO-218 - - -