- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
938
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-252 D-PAK COPPER
|
0.842" (21.40mm) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | |||
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-252, 8 X
|
0.900" (22.86mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W |
