- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
25,551
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3 dias |
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM CPU
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Top Mount | Square, Pin Fins | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.275" (7.00mm) | 31.00°C/W | ||
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ASSMANN WSW Components |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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Board Level, Vertical | Rectangular, Fins | 0.984" (25.00mm) | PC Pin | TO-220 | 0.894" (22.71mm) | 35.20°C/W |
