- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK BXB50,75,100,150.95"HRZ
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517 | 0.950" (24.13mm) | 11.0W @ 60°C | 2.00°C/W @ 300 LFM | ||
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Wakefield-Vette |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK BXB50,75,100,150.24"HRZ
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527 | 0.240" (6.10mm) | 5.0W @ 60°C | 5.80°C/W @ 300 LFM |
