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- Material：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Diameter | Attachment Method | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Diameter | Attachment Method | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
547
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 EPOXY INSUL BLK
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260 | Board Level | Beryllium Copper | 0.290" (7.37mm) ID | Bolt On | 14.00°C/W | Black Ebonol | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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THERMAL LINK PRESSON BLK TO-5
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- | Top Mount | Brass | 0.380" (9.65mm) OD | Press Fit, Bolt On | 82.00°C/W | Black Cadmium | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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THERMAL LINK PRESSON NKL TO-5
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- | Top Mount | Brass | 0.380" (9.65mm) OD | Press Fit, Bolt On | 82.00°C/W | Dull Nickel |
