- Series：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 2,084
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 36.83X57.6X5.84MM T766
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pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK 36.83X57.6X17.78MM T766
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pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.12°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.12°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
95
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
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pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 42.16MM
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- | Board Level, Vertical | 1.750" (44.45mm) | Bolt On and PC Pin | TO-220 | 0.380" (9.65mm) | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | Black Anodized | ||
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ASSMANN WSW Components |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK BLK ALUM TO-220 DUAL
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- | Board Level | 1.750" (44.45mm) | Bolt On | TO-220 (Dual) | 0.370" (9.40mm) | - | - | 7.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 DUAL BLACK
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- | Board Level | 0.780" (19.81mm) | Bolt On | TO-220 | 0.850" (21.60mm) | - | 5.00°C/W @ 200 LFM | 6.40°C/W | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.750" (44.45mm) | Bolt On | TO-220 | 0.380" (9.65mm) | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Top Mount | 0.530" (13.46mm) | Thermal Tape, Adhesive (Not Included) | 28-DIP | 0.190" (4.83mm) | 2.5W @ 80°C | 10.00°C/W @ 700 LFM | 32.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM FP
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.46°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM FP
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pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.81°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM FP
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pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.10°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM FP
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pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.55°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM FP
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pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.40°C/W @ 100 LFM | - | Blue Anodized | |||
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|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM FP
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.90°C/W @ 100 LFM | - | Blue Anodized | |||
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|
Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM FP
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.19°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
7
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM FP
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM FP
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.50°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.81°C/W @ 100 LFM | - | Blue Anodized |
