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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
125
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3 dias |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 90X90X10MM
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Top Mount | Copper | Square, Fins | Push Pin | BGA | 0.394" (10.00mm) | 1.30°C/W @ 200 LFM | 4.50°C/W | AavSHIELD 3C | ||
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Delta Electronics |
12
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ASSY INTEL NEHALEM 1366
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Board Level | Aluminum | Square, Fins | Bolt On | LGA | 1.004" (25.50mm) | - | 0.26°C/W | - | ||
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Delta Electronics |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK ASSY INTEL LGA1366
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Board Level | Aluminum | Square | Bolt On | LGA | 1.004" (25.50mm) | - | 0.27°C/W | - |
