- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
Advanced Thermal Solutions Inc. |
1,439
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 ALUMINUM
|
- | Board Level, Vertical | Rectangular, Angled Fins | 0.985" (25.00mm) | Bolt On and Board Mounts | TO-220 | 0.335" (8.50mm) | 6.70°C/W @ 200 LFM | 12.00°C/W | |||
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|
|
Wakefield-Vette |
913
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-247 SCREW
|
678 | Board Level, Vertical | Rectangular, Fins | 0.984" (25.00mm) | Bolt On and Board Mounts | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - | ||
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|
|
Wakefield-Vette |
903
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-247 W/CLIP
|
678 | Board Level, Vertical | Rectangular, Fins | 0.984" (25.00mm) | Clip, Solder Foot | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - | ||
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|
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ASSMANN WSW Components |
420
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Rectangular, Fins | 0.748" (19.00mm) | Bolt On and PC Pin | SOT-32, TO-220 | 0.844" (21.44mm) | - | 7.50°C/W |
