- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
1,439
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 ALUMINUM
|
- | Rectangular, Angled Fins | 0.985" (25.00mm) | TO-220 | 0.335" (8.50mm) | 6.70°C/W @ 200 LFM | 12.00°C/W | |||
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Wakefield-Vette |
913
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-247 SCREW
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678 | Rectangular, Fins | 0.984" (25.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - |
