- Series：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 6,202
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
Advanced Thermal Solutions Inc. |
209
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X25MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 2.66°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
235
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X15MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 12.01°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
114
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12.7MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 13.83°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
102
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12.7MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 26.30°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
82
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 60X60X22MM
|
- | Top Mount | Copper | Push Pin | BGA | 0.866" (22.00mm) | 0.80°C/W @ 300 LFM | 7.20°C/W | AavSHIELD 3C | ||
|
|
|
t-Global Technology |
53
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 60X60X15MM W/TAPE
|
- | Heat Spreader | Ceramic | Thermal Tape, Adhesive (Included) | - | 0.590" (15.00mm) | - | - | - | ||
|
|
Advanced Thermal Solutions Inc. |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X10MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 8.65°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
92
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.472" (12.00mm) | 6.39°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
57
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X20MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 3.60°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
57
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X25MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 6.26°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
57
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X6MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | 13.00°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
56
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X10MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 7.71°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
90
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X15MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 5.23°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
39
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X10MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 16.28°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
85
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X20MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 8.37°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
71
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X10MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 16.28°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
36
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X15MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 12.01°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X10MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 16.28°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X15MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 12.01°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
90
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12.7MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 13.83°C/W @ 100 LFM | - | Blue Anodized |
